MHNV AI Video Tracking Board for UAV Drone & Target Tracking Module

Engineer Manager Name: Jacky

WhatsApp/ Wechat: 0086-187 9245 6795

Email: mh_elec@126.com or jacky@mh-elec.com

Why Choose MHNV AI tracking board?

1.The only Cameralink + SDI dual-input AI tracker in its class

Most AI tracking modules force you to choose one camera interface. MHNV®️Trac-H-DX-30 takes both — letting you build cross-modal systems

(e.g. machine-vision telephoto + drone EO chain) on a single PCB. No external capture card, no FPGA bridge, no latency stack-up.

2.Mil-grade environmental envelope without losing AI horsepower

Many "rugged" modules sacrifice compute to hit wide-temp specs. The MHNV Trac-H-DX-30 keeps the full RK3588 6 TOPS NPU —

same AI as our flagship Trac-S-MP-20 — while extending operating range to −40 ~ +65 °C and adding reinforced EMI

shielding. No de-rating. No silicon swap. Suitable for arctic, desert and high-EMI vehicle/aircraft platforms.

3.A pre-engineered family — interface-customizable in days, not months

Trac-H-DX-30 is the most-shipped variant of a 7-SKU platform. If your camera uses MIPI, dual SDI, Sony LVDS or pure

Cameralink, we already have a board for that. Same software stack, same SDK, same NPU. Custommechanical adapters, connector

pinouts and firmware skinning available on request.

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Customization — Choose Your Interface Variant (H2 block)

The MH Trac-H-DX-30 is the flagship of a 7-SKU platform. Same RK3588 6 TOPS AI core, same SDK, same firmware lineage.

We pick the interface combination that matches your camera. All 7 variants ship from the same factory; lead time

and MOQ are identical.

✅ Firmware skinning (your logo, your OSD, your protocol)

✅ Connector pinout mapping to your harness

✅ Mechanical adapter / mounting bracket

✅ Sensor driver porting (Sony / OV / GalaxyCore / FLIR / GuideIR)

✅ Custom AI model integration (YOLO / RT-DETR / proprietary weights)

✅ Branded packaging & private-label OEM

✅ MOQ from 1 unit for engineering samples; volume pricing from 10 units

MHNV Trac Series · AI Video Tracking Boards — 7-Product Comparison
Specification	MH-H-DX-30★ Hero	MH-H-SD-30	MH-H-LV-30	MH-H-CL-30	MH-S-MP-20	MH-L-SD-10	MH-L-MP-10
Series	Trac-H	Trac-H	Trac-H	Trac-H	Trac-S	Trac-L	Trac-L
Positioning	Hardened dual-source (Cameralink + SDI) flagship	Hardened dual-SDI fusion (EO + IR)	Hardened LVDS (Sony) + DVP fusion	Hardened Cameralink industrial vision	Flagship AIoT for commercial drones	Compact SDI tracker for small UAVs	Ultra-compact MIPI for sensor module integration
AI / Algorithm
SoC / NPU	Rockchip RK3588 · 6 TOPS NPU	Rockchip RK3588 · 6 TOPS NPU	Rockchip RK3588 · 6 TOPS NPU	Rockchip RK3588 · 6 TOPS NPU	Rockchip RK3588S · 6 TOPS NPU	No dedicated AI accelerator	No dedicated AI accelerator
Tracking algorithms	Centroid · Correlation · KCF · AI (4)	Centroid · Correlation · KCF · AI (4)	Centroid · Correlation · KCF · AI (4)	Centroid · Correlation · KCF · AI (4)	Centroid · Correlation · KCF · AI (4)	Centroid · Correlation · KCF (3)	Centroid · Correlation · KCF (3)
Detection methods	4 (incl. moving-target & template)	4 (incl. moving-target & template)	4 (incl. moving-target & template)	4 (incl. moving-target & template)	4 (incl. moving-target & template)	2 (no moving-target)	2 (no moving-target)
Frame rate	60 Hz	60 Hz	60 Hz	60 Hz	60 Hz	30 Hz	30 Hz
Recognition accuracy (mAP@0.5)	0.616	0.616	0.616	0.616	0.616	0.472	0.472
Multi-target capacity	≤ 64	≤ 64	≤ 64	≤ 64	≤ 64	≤ 32	≤ 32
Camera Interface
Video input	1× Cameralink + 1× SDI	2× SDI + 1× CVBS	1× LVDS (Sony) + 1× DVP	1× Cameralink (Base)	2× MIPI (custom)	1× SDI (3G/HD-SDI) + 1× CVBS	2× MIPI (custom)
Video output	1× SDI	1× SDI + 1× CVBS	1× SDI	External I/F (configurable)	1× Network (RTSP/Gigabit)	1× SDI	1× CVBS
External I/F	UART · I2C · GPIO · Ethernet	UART · I2C · GPIO · Ethernet	UART · I2C · GPIO · Ethernet	UART · I2C · GPIO · Ethernet	UART · I2C · GPIO · USB	UART · I2C · GPIO	UART · I2C · GPIO
Mechanical / Electrical
Power consumption	< 10 W	< 10 W	< 10 W	< 10 W	< 6 W	< 4 W	< 4 W
Power supply	5 V DC	5 V DC	5 V DC	5 V DC	5 V DC	5 V DC	5 V DC
Dimensions (L×W mm)	85 × 55	85 × 55	70 × 66	76 × 50	55 × 40	60 × 45	43 × 38
Weight	~ 55 g	~ 50 g	~ 55 g	~ 50 g	Lightweight	28.2 g	21.6 g
Onboard storage	64 GB	64 GB	64 GB	64 GB	32 GB	8 / 16 GB	8 GB
Environmental
Operating temperature	−40 ~ +65 °C	−40 ~ +65 °C	−40 ~ +65 °C	−40 ~ +65 °C	−20 ~ +60 °C	−40 ~ +65 °C	−40 ~ +65 °C
Storage temperature	−45 ~ +85 °C	−45 ~ +85 °C	−45 ~ +85 °C	−45 ~ +85 °C	−45 ~ +85 °C	−45 ~ +85 °C	−45 ~ +85 °C
Humidity	5 ~ 95 % (non-condensing)	5 ~ 95 % (non-condensing)	5 ~ 95 % (non-condensing)	5 ~ 95 % (non-condensing)	5 ~ 95 % (non-condensing)	5 ~ 95 % (non-condensing)	5 ~ 95 % (non-condensing)
EMI shielding	Reinforced	Reinforced	Reinforced	Reinforced	Standard	Standard	Standard
Application Fit
UAV / Drone	★★★	★★★	★★★	★★	★★★	★★★	★★★
EO/IR Pod / Gimbal	★★★	★★★	★★★	★★	★★	★★	★★
Border / Sentry	★★★	★★★	★★★	★★	★★	★★	★
Industrial Vision	★★★	★	★★	★★★	★	★	★
Indoor / Robotics	★	★	★	★★	★★★	★	★★
★ Customization:	The hero SKU Trac-H-DX-30 ships with Cameralink + SDI dual-source. The other 6 SKUs are pre-engineered interface variants of the same RK3588 platform — choose the input combination that matches your camera. Custom firmware, branding, mechanical adapters and connector pinouts available on request. MOQ from 1 unit for evaluation.

FAQ — AI Video Tracking Board

Q1: What is the difference between Trac MH-H-DX-30, MH-H-SD-30 and MH-S-MP-20?

All three use the same Rockchip RK3588 with 6 TOPS NPU and deliver 60 Hz tracking with 64 multi-targets. The difference is interface and environmental rating: Trac Trac MH-H-DX-30 has Cameralink + SDI dual input and wide-temp −40~+65 °C with EMI shielding. MH-H-SD-30 swaps the Cameralink for a second SDI (best for dual-SDI EO+IR fusion).

MH-S-MP-20 is the commercial sibling — MIPI input with IP/RTSP output, smaller (55×40 mm) and cheaper, but limited to −20~+60 °C without EMI hardening.

Q2: Can I use my own AI model on the MHNV Trac-H-DX-30?

Yes. The RK3588 NPU runs models converted to RKNN format (we provide the toolchain). YOLOv5/v8, RT-DETR,MobileNet variants and many proprietary detectors are supported. Our application team can port your PyTorch /ONNX model on request.

Q3: Does the Trac MH-H-DX-30 work with thermal cameras?

Yes — via the SDI input (most thermal cores expose SDI) or with the Trac-H-LV-30 variant for direct Sony LVDS thermal cores (FCB-EV, FLIR Boson, GuideIR, etc.).

Q4: What is the minimum order quantity?

MOQ is 1 unit for evaluation of any variant. Volume pricing kicks in at 10 units. Lead time for stock variants is 7–14 days; custom firmware adds 2–3 weeks.

Q5: Is the Trac MH-H-DX-30 export-controlled?

The board is a commercial AI vision module. It is exported worldwide except to embargoed jurisdictions. Contact us for regional shipping confirmation.

Q6: What software / SDK is included?

A Linux BSP, the RKNN runtime, MHNV's tracking SDK (C/C++ + Python bindings), example applications and a Windows-side debug tool. Source-level licensing available for OEM integrators.

Q7: How does Trac MH-H-DX-30 compare to NVIDIA Jetson Orin Nano?

Trac MH-H-DX-30 is a purpose-built tracking board with integrated video capture (Cameralink + SDI), tracking firmware ready out of the box, and a hardened −40~+65 °C envelope. Jetson Orin Nano is a general-purpose AI dev kit requiring a capture daughterboard, custom carrier, and software development. For closed-loop tracking on a drone or gimbal, MH-H-DX-30 is faster to integrate and lower BOM.

Engineer Manager Name: Jacky

WhatsApp/ Wechat: 0086-187 9245 6795

Email: mh_elec@126.com or jacky@mh-elec.com

Request A quick Quote (WhatsApp: +86-18792456795 )